6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE

CAS5617-70-9

6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE (CAS 5617-70-9, C8H10 O4) is supplied by ChemSigma for research and manufacturing, with specification, analytical methods and batch documentation available on request.

Chemical structure of 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE
C8H10 O4 · 170.16 g/mol
CAS No.
5617-70-9
Formula
C8H10 O4
Mol. weight
170.16 g/mol

Chemical Specifications

Identifiers

CAS number 5617-70-9
Product name 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE
Chinese name 6,6-二甲基-5,7-二恶螺旋2.5辛烷-4,8-二酮
Synonyms 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE
Chinese synonyms 6,6-二甲基-5,7-二恶螺旋2.5辛烷-4,8-二酮; 6,6-二甲基-5,7-二噁螺旋2.5 辛烷-4,8-二酮; 6,6-二甲基-5,7-二氧杂螺[2.5]辛烷-4,8-二酮; 6,6-二甲基-5,7-二氧杂螺[2.5]辛烷-4,8-二酮,99%; 1,1-环丙烷二甲酸环异亚丙酯; 1,1-环丙烷二羧酸环异亚丙酯
Molecular formula C8H10 O4
Molecular weight 170.16 g/mol
EC number 227-044-5

Physical and chemical properties

Melting Point 65-65 ( ℃ )
Boiling Point 215.9 ( ℃ )

Packaging, Storage & Transport

Available pack sizes 5kg, 1kg, 500g, 100g, 50g, 10g

Read the current safety data sheet before handling. Packaging can be adapted to the order quantity and destination.

Frequently Asked Questions

What is the CAS number of 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE?

The CAS Registry Number of 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE is 5617-70-9. 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE is also known as 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE.

What is the molecular formula and molecular weight of 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE?

The molecular formula of 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE is C8H10 O4, and its molecular weight is 170.16 g/mol.

How can I request a quotation for 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE?

Send an inquiry for 6,6-DIMETHYL-5,7-DIOXASPIRO[2.5]OCTANE-4,8-DIONE (CAS 5617-70-9) with the required quantity, target specification, destination country and any documentation requirements. ChemSigma will confirm availability, packaging, lead time and price.

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