TETRAPHENYLLEAD

CAS595-89-1

TETRAPHENYLLEAD (CAS 595-89-1, C24H20Pb) is supplied by ChemSigma for research and manufacturing, with specification, analytical methods and batch documentation available on request.

Chemical structure of TETRAPHENYLLEAD
C24H20Pb · 515.62 g/mol
CAS No.
595-89-1
Formula
C24H20Pb
Mol. weight
515.62 g/mol
Appearance
white powder

Chemical Specifications

Identifiers

CAS number 595-89-1
Product name TETRAPHENYLLEAD
Chinese name 四苯基铅
Synonyms TETRAPHENYLLEAD
Chinese synonyms 四苯基铅; 四苯鉛; 四苯基铅,97%
Molecular formula C24H20Pb
Molecular weight 515.62 g/mol
EC number 209-871-3

Physical and chemical properties

Appearance white powder
Melting Point 227-228 ( ℃ )
Boiling Point 256.4 ( ℃ )

Applications

Four phenyl lead properties<BR>Melting point 227-228 ° C<BR>The boiling point 270 ° C<BR>1,53 g/cm3 density<BR>Flashpoint 126 ° C / 13mm<BR>

Packaging, Storage & Transport

Available pack sizes 5kg, 1kg, 500g, 100g, 50g, 10g

Read the current safety data sheet before handling. Packaging can be adapted to the order quantity and destination.

Frequently Asked Questions

What is the CAS number of TETRAPHENYLLEAD?

The CAS Registry Number of TETRAPHENYLLEAD is 595-89-1. TETRAPHENYLLEAD is also known as TETRAPHENYLLEAD.

What is the molecular formula and molecular weight of TETRAPHENYLLEAD?

The molecular formula of TETRAPHENYLLEAD is C24H20Pb, and its molecular weight is 515.62 g/mol.

What is TETRAPHENYLLEAD used for?

Four phenyl lead properties<BR>Melting point 227-228 ° C<BR>The boiling point 270 ° C<BR>1,53 g/cm3 density<BR>Flashpoint 126 ° C / 13mm<BR>

How can I request a quotation for TETRAPHENYLLEAD?

Send an inquiry for TETRAPHENYLLEAD (CAS 595-89-1) with the required quantity, target specification, destination country and any documentation requirements. ChemSigma will confirm availability, packaging, lead time and price.

Request a Quote for TETRAPHENYLLEAD

Tell us the required quantity, target specification, destination country and any documentation requirements. We will confirm availability, packaging, lead time and price.